According to a recent report, the upcoming Intel Arrow Lake CPUs are expected to feature a revised temperature hotspot compared to previous designs. The installation of the newly released Intel Core i9-13900 Extreme processor may impact the performance of current CPU coolers and, more notably, CPU liquid cooling blocks designed specifically for LGA1700 motherboards. To maximize performance, potential enhancements may also be necessary.
The highly anticipated Arrow Lake structure is poised to be Intel’s most impressive CPU launch in recent memory, boasting versatile Core i9-200 series processors that stand a strong chance of rivalling AMD for top spot on our list of best gaming CPUs. While some enthusiasts may be eager to upgrade their high-end cooling systems for newer CPUs on the LGA1851 socket, they should be aware that a direct swap will not necessarily provide optimal cooling performance.
In computer architecture, the sweet spot for a central processing unit (CPU) refers to the specific area on its heatspreader where the processor tends to run hottest during typical high-performance computing scenarios. The thermal design power (TDP) of this processor can vary depending on the specific CPU architecture and its location under the integrated heat spreader (IHS), potentially shifting when migrating between distinct platforms or form factors.
Significantly, as a result of this phenomenon, CPU cooler manufacturers, especially those designing CPU waterblocks, tend to focus intensely on addressing the hottest areas of their coolers and waterblocks. By directing the chilled water directly at the hotspot area of the chip, one can potentially reduce the temperature of this critical component by a few degrees, thereby allowing for more aggressive overclocking or a lower overall system temperature.
According to a groundbreaking study conducted by renowned waterblock designer and YouTube personality Der8auer, significant changes have been discovered in the architecture of Intel’s newly released Arrow Lake CPUs when compared to their predecessors, Raptor Lake and Alder Lake, with findings based on leaked images of the innovative new chips. Given the fundamental design change from LGA1700 to LGA1851, it’s hardly surprising that the new chips wouldn’t be simply astonishing in any regard. While some aspects of the new socket design share similarities with its predecessor, it’s likely that CPU cooler manufacturers and end-users had anticipated the possibility of adapting existing coolers to accommodate this fresh iteration.
Before you hastily grab a top-tier CPU cooler without considering your specific needs, keep in mind that this distinction should only make a significant impact for those users who are already pushing their systems to their limits. While coolers specifically tailored to sizzling hotspots may not be commonplace, conventional coolers are typically engineered to perform optimally across a range of AMD and Intel CPU configurations.
Despite these nuances, should you’re aiming to overclock or optimise your system for peak cooling performance, certain coolers may outperform others for specific CPUs, potentially altering the CPU cooler landscape as a result of changes in sizzling spot location.
The shift on LGA1700 CPUs has seen a move from the heatspreader’s center towards its northern edge. Notably, this change also implies that rotating the block 180 degrees would negatively impact performance, as users won’t be able to easily flip their coolers to accommodate the new spot.
Until we’ve thoroughly evaluated the general heat output and efficiency of Intel’s new Arrow Lake processors, it will be difficult to gauge the impact of this change on average users or hardcore overclockers. While details on the upcoming Intel CPUs are scarce, rumors surrounding their specifications have sparked significant interest among tech enthusiasts.
