Thermal Grizzly inadvertently spills the beans on two unannounced X3D gaming CPUs by confirming compatibility with their cooling products. AMD has previously announced its upcoming Ryzen 9000X3D lineup, building upon the success of the Ryzen 7 7800X3D, but the company has maintained a veil of secrecy surrounding the model names of these new processors.
One of the two newly unveiled AMD CPUs discussed by Thermal Grizzly is the Ryzen 7 9800X3D, a highly anticipated release that promises to be a top contender in the world of gaming CPUs upon its launch. As AMD’s Ryzen 9000X3D launch approaches in November 2024, speculation swirls around potential compatibility with the upcoming CPU, while a separate mention of another X3D chip raises intrigue about further developments.
The Ryzen 9 5950X3D is anticipated to feature 16 cores, drawing from previous AMD model numbers, including the Ryzen 9 4950X. Although neither the 9950X3D nor the 9800X3D have been officially unveiled by AMD, Thermal Grizzly has taken the initiative to introduce these new GPUs early.
Thermal Grizzly has confirmed internally that both the Ryzen 9800X3D and the 9950X3D can be compatible with some of their products, suggesting that samples of the 9950X3D are already circulating. When AMD launches its 9800X3D processor, industry experts predict it will outpace its predecessor, the 7800X3D, resulting in significantly improved benchmark scores for the newer chip.
The corporation outlines a diverse array of merchandise deemed compatible with their new chips, including several direct-die waterblocks engineered to facilitate direct contact between the CPU and chips once the substantial metal heat spreader has been removed. The corporation’s Ryzen 7000 delidding tool, designed to eliminate the heatspreader, may also prove useful; similarly, its lapping device enables users to flatten the heatspreader’s surface, thereby achieving optimal contact with their CPU cooler’s contact plate.
Despite this, Thermal Grizzly acknowledges that their Ryzen 7000 Direct Die Body may require modifications to be compatible with new chips, noting “adjustments could occur during processor manufacturing.” The company warns that changes in adhesive factors on SMD parts on circuit boards can sometimes result from these adjustments and recommends customers contact support if any issues arise.
The anticipation surrounding the upcoming Ryzen 9000X3D release is palpable, especially in light of Intel’s underwhelming performance with their Arrow Lake processor. Discover how the latest Intel Core i7-12700K performs in various gaming scenarios by reading our comprehensive review.
