Samsung is readying up some fairly groundbreaking tech: stacking reminiscence on a CPU or a GPU to probably drastically enhance efficiency. Switching to this method could have an effect on efficiency, energy effectivity, and capability. Sadly, many people won’t ever instantly expertise the advantages of this, as Samsung goes to make use of its high-bandwidth reminiscence (HBM), that means we received’t discover it even in the very best graphics playing cards obtainable.
The tech in query includes a brand new 3D packaging methodology that belongs to Samsung’s Superior Interconnect Expertise (SAINT) platform, with this newest iteration being dubbed SAINT-D. Every variant includes a unique 3D stacking expertise, with SAINT-S stacking the SRAM die on high of the logic die; SAINT-L stacking logic; and eventually, SAINT-D stacking HBM reminiscence on high of logic chips, that means both CPUs or GPUs.
SAINT-D introduces stacking HBM vertically on high of the processor and connecting it by means of a substrate between the 2 chips. This can be a enormous change from Samsung’s present 2.5D packaging strategy, which connects the HBM chips to the GPU horizontally with a silicon interposer.
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The introduction of 3D packaging might be step one towards launching Samsung’s next-gen HBM4. Samsung itself refers to SAINT-D as a “DRAM breakthrough for HPC and AI.” The corporate additionally described the advantages of utilizing this method, as cited by The Korea Financial Day by day: “3D packaging reduces energy consumption and processing delays, enhancing the standard {of electrical} indicators of semiconductor chips.”
As introduced throughout the Samsung Foundry Discussion board 2024, the corporate will supply its new 3D HBM packaging as a part of a turnkey service. This implies an end-to-end resolution the place Samsung will each produce the HBM chips and combine them onto GPUs for fabless firms. As SAINT-D is claimed to be making its debut this 12 months, and the next-gen HBM4 mannequin is ready to reach in 2025, this new methodology might make fairly the splash in HPC use instances very quickly, together with varied AI makes use of.
Samsung’s breakthrough doesn’t imply a lot for customers — not but. HBM reminiscence is, because the title itself implies, utilized in high-performance environments, and to high all of it off, this 3D packaging expertise is reportedly much more costly to supply than its predecessors. Nevertheless, 3D VRAM is an attention-grabbing idea. Maybe if it really works out effectively in information facilities, it might someday make its solution to our PCs.
